Process Capability

project	content	Process capability	Remark
1	Number of layers	1-8 layers	Refers to the number of electrical layers in the PCB (the number of copper-clad layers). Currently, the hunting board only accepts 1~8-layer through-hole boards (blind-buried via boards are not accepted)
2	Laminated structure	4 floors, 6 floors, 8 floors	---
3	Plank	FR-4	KB-6160(TG135) KB-6165F(TG150) KB-6167F(TG170)
3	Plank	CEM-1	KB-5150
4	Ink	Widely believed	Halogen-free solder mask ink solder mask ink
4	Ink	Sun	Text spray ink
5	Production board size (maximum)	1000×600mm	Single-sided and double-sided: single chip and jigsaw 1000600mm (the width of the V-CUT rail direction is no more than 600mm) Multilayer board: single piece 625500mm, jigsaw 625*480mm (VCUT direction cannot exceed 480mm)
6	Production board size (minimum)	1×3mm	The minimum production size of veneer>1×3mm, ≤20×20mm is ultra-small board The minimum production size of the jigsaw puzzle>60×60mm, the minimum production size of the V-slot jigsaw puzzle>76×76mm Remarks: OSP≥5080mm Shen tin≥80120mm
7	Board thickness (maximum)	2.4mm	Board thickness: 0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4mm
8	Board thickness (minimum)	0.25mm	Board thickness: 0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4mm
9	Core thickness (minimum)	0.20mm	Copper thickness
10	Finished product thickness tolerance (board thickness ≥0.8mm)	±10%	For example, the board thickness T=1.6mm, the actual board thickness is 1.44mm (T－1.6×10%) ~ 1.76mm (T＋1.6×10%)
11	Finished product thickness tolerance (0.3mm≤plate thickness<0.8mm)	±0.10mm	For example, the board thickness T=0.6mm, the actual board thickness is 0.5mm (T-0.1) ~ 0.7mm (T+0.1)
12	Plate curve (minimum)	0.75%	Diagonal length*0.75%
13	Drilling hole diameter (maximum)	Φ6.5mm	Expandable hole larger than 6.5mm
14	Drilling hole diameter (minimum)	Φ0.20mm	0.20mm is the smallest hole diameter
15	Outer bottom copper thickness (minimum)	Single-sided and double-sided: Hoz, multi-layer 1/3oz	Refers to the minimum thickness of the outer circuit copper foil of the finished circuit board, the smallest board hunting: single-sided and double-sided Hoz, multi-layer 1/3oz
16	Outer bottom copper thickness (maximum)	4oz	Refers to the maximum thickness of the outer circuit copper foil of the finished circuit board, and the maximum thickness of the hunting board is 4oz
17	Inner bottom copper thickness (minimum)	1/3oz	Refers to the minimum thickness of the copper foil of the inner layer of the finished circuit board, and the minimum thickness of the hunting board is 1/3oz
18	Inner bottom copper thickness (maximum)	3oz	Refers to the maximum thickness of the copper foil of the inner layer of the finished circuit board, and the maximum thickness of the hunting board is 3oz
19	Insulation thickness (minimum)	0.10mm	The thickness of PP film after lamination is 0.10mm
20	Hole plating aspect ratio (maximum)	10:1
twenty one	Aperture tolerance (PTH has copper holes)	±0.075mm	PTH has copper holes: the tolerance of the drilling is ±0.075mm, for example, the hole designed as 0.6mm, the finished hole of the physical board is 0.525mm-0.675mm, which is qualified and allowed
twenty two	Aperture tolerance (NPTH no copper hole)	±0.05mm	NPTH no copper hole: the tolerance of the drilling is ±0.05mm, for example, the hole designed as 0.6mm, the finished hole of the physical board is 0.55mm-0.65mm, which is qualified and allowed
twenty three	Hole position tolerance	±0.05mm
twenty four	Hole wall thickness (through hole)	Regular average value≥18um	Customers can specify otherwise
25	Outer layer design line width/spacing (minimum)	T/Toz: 2.5mil/2.5mil（T=1/3oz） H/Hoz: 2.5mil/2.5mil 1/1oz: 3mil/3mil 2/2oz: 6mil/6mil 3/3oz: 10mil/10mil 4/4oz：14 mil/14mil	This parameter is the default
26	Inner layer design line width/spacing (minimum)	T/Toz: 2.5mil/ 2.5mil（T=1/3oz） H/Hoz: 2.5mil/2.5mil 1/1oz: 3mil/3mil 2/2oz: 6mil/6mil 3/3oz: 10mil/10mil 4/4oz：14 mil/14mil	This parameter is the default
27	Etching tolerance	±15%	For example, the line width T=4mil, the actual line width is 3.4mil (T－4mil×15%)~4.6mil (T＋4mil×15%)
28	Accuracy of hole position of outer graphics (minimum)	±3mil	The accuracy of the line image to the hole position, the actual difference of ±3mil is qualified
29	Hole position to hole position accuracy (minimum)	±2mil	The line image hole position to the physical hole position accuracy ± 2mil is qualified
30	Tolerance of solder mask alignment accuracy	±3mil	The accuracy tolerance of the line image to the solder mask position is ±3mil as qualified
31	Solder mask thickness (minimum)	≥8μm	Solder mask adopts Guangxin ink ≥8μm
32	Bridge width of solder mask (minimum)	Green oil: 4mil black/white: 5mil other variegated oil: 4mil	If there is a requirement for solder mask bridge, it must be noted! The price of the solder mask bridge will rise according to the process requirements. If the solder mask color is green, the width of the ink reserved between the pads must be ≥4mil (7 mils are required to complete the line pad spacing with a copper thickness of 1oz), and the width of the ink reserved between the black and white pads must be ≥5mil (to complete the copper thickness of 1oz The line pad spacing needs to be 7mil), the remaining ink width between other variegated oil pads must be ≥4mil
33	Hole diameter of solder mask	≤0.45mm	The hole diameter of the hunting board solder mask plug hole is specified to be ≤0.45mm, and the oil plug will not be full by default when the inner hole of the board is ≥0.45mm
34	Immersion Nickel Immersion Gold Nickel Thickness	100-200uin （μ "）	Special needs can be specified
35	Immersion Nickel Immersion Gold Gold Thick	1-3uin（μ"）	Special needs can be specified
36	Tin thickness (hot air leveling)	2-40μm
37	Milling profile tolerance	±4mil
38	Milling profile tolerance (hole to edge)	±4mil
39	Milling profile arc (inner angle) (minimum)	R≥0.5mm
40	Milling countersunk hole diameter	According to customer requirements	According to customer requirements
41	V-CUT residual thickness tolerance (minimum)	±0.10mm	The minimum residual thickness tolerance of V-CUT is ±0.10mm
42	V-CUT dislocation degree (minimum)	0.10mm	V-CUT misalignment minimum 0.10mm
43	V-CUT board thickness (minimum/maximum)	0.5mm/3.2mm	Currently supports V-CUT board thickness 0.5mm～3.2mm (≤0.4mm recommended stamp hole, if specified, V-CUT does not meet the tolerance of ±0.10mm by default)
44	Impedance tolerance (minimum)	±10%	For example, the selected impedance value is T=50Ω, and the actual impedance is 45Ω (T-50Ω×10%) ~ 55Ω (T＋50Ω×10%)
45	Hole pitch/hole to wire process range		VIA via hole to hole 0.3MM PTH component hole to component hole 0.5MM Via via to line 0.2MM PTH component hole to line 0.3MM
46	High-end option process	V-CUT length is not limited, four-wire flying test, two-color solder mask, two-color text	The distance between the last two cuts of V-CUT≥2mm Flying test minimum pad ≥4*8mil (this entry is effective when high-end charges are added) Two-color solder mask seamless butt tolerance +/-1mm

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